Hengdar｜Display & Touch Module Manufacturer in Taiwan
FPC / Touch & Display Integration / Commercial Food Waste Processor
Commercial fermentation-type food waste disposer
This fermentation-type food waste disposer is designed for restaurants, central kitchens, and institutional catering facilities. Using high-temperature microbial decomposition, it reduces food waste by over 90% within 12–14 hours and converts it into reusable compost.
The system integrates cloud-based IoT management, automatic weighing, remote monitoring, and multiple safety features for efficient commercial food waste management.
Key Features:
● Over 90% food waste reduction within 12–14 hours
● High-temperature microbial decomposition
● Cloud-based IoT remote monitoring
● Automatic weighing and feeding
● Multi-layer deodorization, low noise, and low power consumption
● Overload and leakage protection
Applications:
● Restaurants, central kitchens, and institutional catering
● Schools, corporate cafeterias, and hotels
● Apartment buildings and communities
Commercial Drying Food Waste Disposer
This drying food waste dryer uses heating and grinding technology to reduce food waste volume by up to 85–90%, converting waste into dry powder for easier handling and disposal.
The system supports optional AIoT connectivity for remote monitoring and operating data analysis. Its SUS304 stainless steel construction, low-noise operation, and plug-and-use design make it suitable for a wide range of commercial environments.
Key Features:
● Heating and grinding technology for efficient food waste processing
● Up to 85–90% food waste reduction
● Converts food waste into dry powder
● Optional AIoT remote monitoring
● SUS304 stainless steel construction
● Low-noise and easy-to-maintain design
● 110V plug-and-use operation
Applications:
● Restaurants and institutional catering facilities
● Residential communities and commercial buildings
● Supermarkets and food processing facilities
● Schools and healthcare institutions
Liquid Crystal Display Module(LCM)
Hengdar’s LCM is designed for industrial, commercial, and smart device applications, with multiple sizes, resolutions, and aspect ratios available. The modules also support integration with touch panels (TP) and backlight modules.
Key Features:
● Multiple sizes, resolutions, and aspect ratios
● Low power consumption with stable image quality
● Wide viewing angles for clear display performance
● Supports TP and backlight module integration
Applications:
● Industrial control and HMI systems
● POS, medical, smart home, and commercial displays
● Automotive and transportation systems
Double-Sided Flexible Printed Circuit Board(FPC)
Hengdar’s FPC is designed for compact electronic applications that require flexible routing and reliable connectivity. Its ultra-thin, bendable structure supports customized circuit layouts and integration into space-limited devices.
Key Features:
● Double-sided design with dual-layer EMI shielding
● Ultra-thin (<0.1 mm), flexible, and foldable structure
● High-density copper routing with fewer mechanical connections
● Heat- and chemical-resistant construction
● Customizable circuit layouts and shapes
Applications:
● Smartphones, foldable devices, and wearable electronics
● Medical sensors and hearing devices
● Automotive displays and LED modules
● Laptop displays, touch panels, and camera modules
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